The reporter learned from the National Space Administration that just now, chang'e-5 probe successfully landed in the pre selected landing area of the front of the moon, becoming the third successful lunar soft landing probe in China. After the successful landing, the lander will officially start working on the lunar surface for about two days under the control of the ground.

On the evening of December 1, local time, the European Space Agency (ESA) shared the news of the successful landing of chang'e-5 probe in the lunar frontal pre selected landing area on social media, and congratulated the Chinese national space agency. ESA also said that through its global tracking station network, ESA provided technical support for the chang'e-5 probe.

After the launch of chang'e-5, it was tracked for hours by ESA's kuru ground station in French Guiana. When chang'e-5 returns to earth, ESA will receive signals through the Maspalomas ground station in Spain.

According to the people's daily of China, the flight control team of the chang'e-5 mission has successfully carried out the separation of the lander and the ascent combination of the chang'e-5 probe with the orbiter and reentry vehicle as planned.

At 4:40 am today, under the precise control of scientific and technological personnel, the chang'e-5 probe assembly was successfully separated.

It is reported that the systems of chang'e-5 probe are in good condition, and the ground TT & C communication is normal. The orbiter and the reentrant combination will continue to fly in the lunar orbit with an average height of about 200 km and wait for the rendezvous and docking of the ascender. The lander and the ascent combination will select an aircraft to implement the lunar soft landing and carry out the follow-up work such as automatic sampling.

The landing site will be a storm ocean in the northwest of the moon. Storm ocean is the largest moon sea on the moon, where human probes have never been before. The storm ocean is a younger region with an age of 3.2 billion to 4 billion years, compared with the quiet sea and the rich sea where human beings have obtained lunar samples.

According to the official news of Beidouxingtong, the subsidiary companies of Beidouxingtong and Xinxingtong have officially released the latest generation of full-system full-frequency centimeter-level high-precision GNSS chips-Hexin Nebulas IV.

According to reports, this chip represents the highest level of domestic satellite navigation chips, has groundbreaking significance in the field of centimeter-level high-precision positioning, and has a leading advantage in the world. While the Nebulas IV chip is iteratively evolving to 22nm, it is the first to realize the integration of baseband + radio frequency + high-precision algorithm on a single chip, supports on-chip RTK, meets the requirements of vehicle regulations, and has better performance, size, and power consumption. The previous generation of chips made breakthroughs to meet the needs of popular applications and better meet the needs of high-end applications such as smart driving and drones.

Various applications based on Beidou will go global with the opening of Beidou system global services. Nebulas IV supports all satellite navigation systems and frequencies in the world, including the latest Beidou III B1C, B2a, and B2b, which will provide a better positioning experience for the broader international market.

TSMC plans to start construction in February next year, formally install 5nm for trial production in 2023, and mass production in 2024. TSMC finalized the two generals, Lin Tinghuang, the director of the 15A plant of the Zhongke plant, and Wu Yihuang, the senior director of the technical department, to be responsible for the construction and operation of the plant.

TSMC’s supply chain revealed that TSMC’s U.S. plant construction plan has been carried out as planned. Currently, it has targeted 5nm advanced process equipment. Which ones will be moved by the Nanke plant and which ones will decide to purchase more. Compare the list with the equipment manufacturers one by one, and require List the delivery dates; the relevant chemical suppliers also indicated that they have cooperated with TSMC's requirements and have already started the relevant factory setting operations.

TSMC's US plant is located in the suburbs of Phoenix, Arizona, only about an hour's drive from the Intel plant, and the transportation is relatively convenient.

In May of this year, TSMC announced that it intends to build and operate an advanced wafer fab in the United States with the common understanding and commitment of the US federal government and Arizona.

TSMC said that the plant to be set up in Arizona will use the company's 5nm process technology to produce semiconductor chips, with a planned monthly production capacity of 20,000 wafers. From 2021 to 2029, TSMC’s expenditures (including capital expenditures) on this project are approximately US$12 billion.

TSMC currently has a fab in Camas, Washington, and design centers in Austin, Texas, and San Jose, California.

Founded in 1987, TSMC is the world's largest foundry semiconductor manufacturing plant. Its customers include Apple, Qualcomm, Nvidia and so on.

　　 Dr. Wang Chenglu, President of Huawei’s Consumer Business Software Department, recently revealed that the adaptation of the mobile version of Hongmeng OS 2.0 is progressing very well, and R&D is ready, and it is expected to be released as scheduled in December.

　　 He also said: "At that time, I hope that the majority of developers and friends can participate together, work together and build the Hongmeng ecosystem."

　　 According to the latest exposure of the digital blogger, the mobile phone Hongmeng OS 2.0 has been tentatively scheduled to open the Beta test version on December 18, and will provide upgrade channels for some mobile phone users in January and February next year, and there will be a few months of preliminary Upgrade verification, and then fully open the upgrade.

　　 Obviously, Huawei is very cautious in upgrading the mobile phone Hongmeng OS. After all, such a disruptive change cannot tolerate any mistakes. It must be done slowly. Everyone must be patient and wait slowly. Maybe it will be this time next year. Complete a comprehensive replacement on Huawei phones.

　　 Wang Chenglu also revealed that more than 90% of Huawei models currently on the market will be upgraded to Hongmeng.

　　 It is reported that as early as May 2016, Huawei decided to build the Hongmeng system internally, and laid out the possible directions of the future market and technology. The core innovation is to treat individual IoT devices as different modules, and then proceed Connected because it is an operating system developed for the Internet of Everything.